Assignee
ALPINE MICROSYSTEMS INC
US·7 granted patents·270 citations·filing 1997–2002
Top patents by PatentIndex Score
7 records- 0193US6175161B1System and method for packaging integrated circuitsALPINE MICROSYSTEMS INC·Filed 1998·Granted Jan 16, 2001·108 cites·20 claims
- 0289US6300161B1Module and method for interconnecting integrated circuits that facilitates high speed signal propagation with reduced noiseALPINE MICROSYSTEMS INC·Filed 2000·Granted Oct 9, 2001·58 cites·15 claims
- 0372US6436735B1Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contactALPINE MICROSYSTEMS INC·Filed 2000·Granted Aug 20, 2002·16 cites·20 claims
- 0471US6128201AThree dimensional mounting assembly for integrated circuitsALPINE MICROSYSTEMS INC·Filed 1998·Granted Oct 3, 2000·47 cites·19 claims
- 0563US6075711ASystem and method for routing connections of integrated circuitsALPINE MICROSYSTEMS INC·Filed 1997·Granted Jun 13, 2000·32 cites·20 claims
- 0647US6620673B1Thin film capacitor having multi-layer dielectric film including silicon dioxide and tantalum pentoxideALPINE MICROSYSTEMS INC·Filed 2002·Granted Sep 16, 2003·4 cites·20 claims
- 0732US6337576B1Wafer-level burn-inALPINE MICROSYSTEMS INC·Filed 1999·Granted Jan 8, 2002·5 cites·26 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →