Assignee
AMKOR TECH JAPAN INC
JP·7 granted patents·2 pending applications·3 citations·filing 2019–2025
Top patents by PatentIndex Score
9 records- 0184US12293950B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH JAPAN INC·Filed 2022·Granted May 6, 2025·1 cites·18 claims
- 0283US12183651B2Semiconductor deviceAMKOR TECH JAPAN INC·Filed 2022·Granted Dec 31, 2024·1 cites·19 claims
- 0374US2025140636A1Semiconductor deviceAMKOR TECH JAPAN INC·Filed 2024·Application pending·0 cites
- 0472US12519065B2Semiconductor devices comprising interconnect terminal with concave recess exposed from dielectric structure at lateral and bottom side of the substrate and methods of manufacturing semiconductor devicesAMKOR TECH JAPAN INC·Filed 2024·Granted Jan 6, 2026·0 cites·20 claims
- 0572US2025259901A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH JAPAN INC·Filed 2025·Application pending·0 cites
- 0670US11887915B2Semiconductor device having outer terminal portions with conductive layer on outer end surfaces and a method of manufacturing a semiconductor deviceAMKOR TECH JAPAN INC·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 0763US11967565B2Semiconductor devices including conductive structure and shielding layer and methods of manufacturing semiconductor devicesAMKOR TECH JAPAN INC·Filed 2022·Granted Apr 23, 2024·0 cites·16 claims
- 0862US11362041B2Semiconductor devices including shielding layer and methods of manufacturing semiconductor devicesAMKOR TECH JAPAN INC·Filed 2019·Granted Jun 14, 2022·1 cites·15 claims
- 0957US11367664B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH JAPAN INC·Filed 2019·Granted Jun 21, 2022·0 cites·21 claims
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