Assignee
AMKOR TECHNOLOGY INC
US·851 granted patents·46 pending applications·38,871 citations·filing 1994–2020
Top patents by PatentIndex Score
897 records- 0199US9406645B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 2, 2016·40 cites·14 claims
- 0299US9214434B1Fan-out semiconductor packageAMKOR TECHNOLOGY INC·Filed 2013·Granted Dec 15, 2015·55 cites·33 claims
- 0399US8710649B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 29, 2014·47 cites·20 claims
- 0499US7932170B1Flip chip bump structure and fabrication methodAMKOR TECHNOLOGY INC·Filed 2008·Granted Apr 26, 2011·197 cites·16 claims
- 0599US7932595B1Electronic component package comprising fan-out tracesAMKOR TECHNOLOGY INC·Filed 2010·Granted Apr 26, 2011·66 cites·18 claims
- 0699US7851894B1System and method for shielding of package on package (PoP) assembliesAMKOR TECHNOLOGY INC·Filed 2008·Granted Dec 14, 2010·114 cites·17 claims
- 0799US7842541B1Ultra thin package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2008·Granted Nov 30, 2010·169 cites·19 claims
- 0899US7777351B1Thin stacked interposer packageAMKOR TECHNOLOGY INC·Filed 2007·Granted Aug 17, 2010·413 cites·24 claims
- 0999US7714431B1Electronic component package comprising fan-out and fan-in tracesAMKOR TECHNOLOGY INC·Filed 2006·Granted May 11, 2010·98 cites·20 claims
- 1099US7671457B1Semiconductor package including top-surface terminals for mounting another semiconductor packageAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 2, 2010·233 cites·12 claims
- 1199US7633765B1Semiconductor package including a top-surface metal layer for implementing circuit featuresAMKOR TECHNOLOGY INC·Filed 2005·Granted Dec 15, 2009·387 cites·23 claims
- 1299US7548430B1Buildup dielectric and metallization process and semiconductor packageAMKOR TECHNOLOGY INC·Filed 2006·Granted Jun 16, 2009·202 cites·19 claims
- 1399US7342303B1Semiconductor device having RF shielding and method thereforAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 11, 2008·144 cites·20 claims
- 1499US7192807B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2005·Granted Mar 20, 2007·139 cites·18 claims
- 1599US7185426B1Method of manufacturing a semiconductor packageAMKOR TECHNOLOGY INC·Filed 2004·Granted Mar 6, 2007·395 cites·20 claims
- 1699US7170183B1Wafer level stacked packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Jan 30, 2007·146 cites·17 claims
- 1799US6930256B1Integrated circuit substrate having laser-embedded conductive patterns and method thereforAMKOR TECHNOLOGY INC·Filed 2002·Granted Aug 16, 2005·235 cites·22 claims
- 1899US6818973B1Exposed lead QFP package fabricated through the use of a partial saw processAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 16, 2004·203 cites·30 claims
- 1999US6791076B2Image sensor packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Sep 14, 2004·190 cites·20 claims
- 2099US6737750B1Structures for improving heat dissipation in stacked semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2001·Granted May 18, 2004·310 cites·31 claims
- 2199US6686588B1Optical module with lens integral holderAMKOR TECHNOLOGY INC·Filed 2001·Granted Feb 3, 2004·267 cites·41 claims
- 2299US6577013B1Chip size semiconductor packages with stacked diesAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·559 cites·28 claims
- 2399US6571466B1Flip chip image sensor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 3, 2003·282 cites·20 claims
- 2499US6555917B1Semiconductor package having stacked semiconductor chips and method of making the sameAMKOR TECHNOLOGY INC·Filed 2001·Granted Apr 29, 2003·353 cites·23 claims
- 2599US6143981APlastic integrated circuit package and method and leadframe for making the packageAMKOR TECHNOLOGY INC·Filed 1998·Granted Nov 7, 2000·476 cites·19 claims
- 2698US10074630B2Semiconductor package with high routing density patchAMKOR TECHNOLOGY INC·Filed 2015·Granted Sep 11, 2018·27 cites·20 claims
- 2798US9780074B2Semiconductor package using a coreless signal distribution structureAMKOR TECHNOLOGY INC·Filed 2016·Granted Oct 3, 2017·24 cites·16 claims
- 2898US9653428B1Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted May 16, 2017·132 cites·20 claims
- 2998US9543242B1Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 10, 2017·73 cites·20 claims
- 3098US9012789B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2014·Granted Apr 21, 2015·31 cites·20 claims
- 3198US8341835B1Buildup dielectric layer having metallization pattern semiconductor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2009·Granted Jan 1, 2013·71 cites·20 claims
- 3298US7859119B1Stacked flip chip die assemblyAMKOR TECHNOLOGY INC·Filed 2008·Granted Dec 28, 2010·82 cites·18 claims
- 3398US7745910B1Semiconductor device having RF shielding and method thereforAMKOR TECHNOLOGY INC·Filed 2007·Granted Jun 29, 2010·115 cites·20 claims
- 3498US7629674B1Shielded package having shield fenceAMKOR TECHNOLOGY INC·Filed 2004·Granted Dec 8, 2009·141 cites·10 claims
- 3598US7572681B1Embedded electronic component packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Aug 11, 2009·103 cites·19 claims
- 3698US7361533B1Stacked embedded leadframeAMKOR TECHNOLOGY INC·Filed 2005·Granted Apr 22, 2008·96 cites·20 claims
- 3798US7334326B1Method for making an integrated circuit substrate having embedded passive componentsAMKOR TECHNOLOGY INC·Filed 2005·Granted Feb 26, 2008·68 cites·19 claims
- 3898US7297562B1Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patternsAMKOR TECHNOLOGY INC·Filed 2005·Granted Nov 20, 2007·42 cites·22 claims
- 3998US6962829B2Method of making near chip size integrated circuit packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 8, 2005·148 cites·19 claims
- 4098US6927478B2Reduced size semiconductor package with stacked diesAMKOR TECHNOLOGY INC·Filed 2002·Granted Aug 9, 2005·193 cites·16 claims
- 4198US6919631B1Structures for improving heat dissipation in stacked semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2004·Granted Jul 19, 2005·154 cites·24 claims
- 4298US6905914B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2002·Granted Jun 14, 2005·117 cites·22 claims
- 4398US6759266B1Quick sealing glass-lidded package fabrication methodAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 6, 2004·220 cites·27 claims
- 4498US6734419B1Method for forming an image sensor package with vision die in lens housingAMKOR TECHNOLOGY INC·Filed 2001·Granted May 11, 2004·209 cites·14 claims
- 4598US6686649B1Multi-chip semiconductor package with integral shield and antennaAMKOR TECHNOLOGY INC·Filed 2001·Granted Feb 3, 2004·336 cites·11 claims
- 4698US6672773B1Optical fiber having tapered end and optical connector with reciprocal openingAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 6, 2004·158 cites·22 claims
- 4798US6624005B1Semiconductor memory cards and method of making sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 23, 2003·304 cites·3 claims
- 4898US6603183B1Quick sealing glass-lidded packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Aug 5, 2003·217 cites·31 claims
- 4998US6545345B1Mounting for a package containing a chipAMKOR TECHNOLOGY INC·Filed 2001·Granted Apr 8, 2003·199 cites·14 claims
- 5098US6531784B1Semiconductor package with spacer stripsAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 11, 2003·299 cites·37 claims
Showing the top 50 of 897 patent records by PatentIndex Score.
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