Assignee
AN JIN YONG
KR·4 granted patents·3 pending applications·23 citations·filing 2008–2012
Top patents by PatentIndex Score
7 records- 0188US8207450B2Printed circuit board comprising metal bumps integrated with connection padsAN JIN YONG·Filed 2009·Granted Jun 26, 2012·13 cites·5 claims
- 0280US8209860B2Method of manufacturing printed circuit board having metal bumpAN JIN YONG·Filed 2009·Granted Jul 3, 2012·9 cites·8 claims
- 0357US8499444B2Method of manufacturing a package substrateAN JIN-YONG·Filed 2008·Granted Aug 6, 2013·1 cites·8 claims
- 0455US2011005824A1Printed circuit board and method of manufacturing the sameAN JIN YONG·Filed 2009·Application pending·0 cites
- 0553US2012210576A1Printed circuit board and method of manufacturing the sameAN JIN YONG·Filed 2012·Application pending·0 cites
- 0651US9021693B2Method of manufacturing printed circuit board with metal bumpAN JIN YONG·Filed 2012·Granted May 5, 2015·0 cites·5 claims
- 0746US2012211464A1Method of manufacturing printed circuit board having metal bumpAN JIN YONG·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →