Assignee
ANDREWS PETER S
US·11 granted patents·2 pending applications·113 citations·filing 2007–2012
Top patents by PatentIndex Score
13 records- 0194US8410512B2Solid state light emitting apparatus with thermal management structures and methods of manufacturingANDREWS PETER S·Filed 2009·Granted Apr 2, 2013·32 cites·17 claims
- 0292USD650343SMultiple configuration light emitting device packageANDREWS PETER S·Filed 2011·Granted Dec 13, 2011·55 cites·1 claims
- 0386US8410371B2Electronic device submounts with thermally conductive vias and light emitting devices including the sameANDREWS PETER S·Filed 2009·Granted Apr 2, 2013·15 cites·14 claims
- 0479US9627361B2Multiple configuration light emitting devices and methodsANDREWS PETER S·Filed 2011·Granted Apr 18, 2017·5 cites·28 claims
- 0573US8835952B2Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulantsANDREWS PETER S·Filed 2011·Granted Sep 16, 2014·3 cites·22 claims
- 0671US9515229B2Semiconductor light emitting devices with optical coatings and methods of making sameANDREWS PETER S·Filed 2010·Granted Dec 6, 2016·3 cites·5 claims
- 0755US8941125B2Light emitting devices for light conversion and semiconductor chips for fabricating the sameANDREWS PETER S·Filed 2008·Granted Jan 27, 2015·0 cites·17 claims
- 0850US9508904B2Structures and substrates for mounting optical elements and methods and devices for providing the same backgroundANDREWS PETER S·Filed 2011·Granted Nov 29, 2016·0 cites·6 claims
- 0947US9054282B2Semiconductor light emitting devices with applied wavelength conversion materials and methods for forming the sameANDREWS PETER S·Filed 2010·Granted Jun 9, 2015·0 cites·17 claims
- 1046US9401461B2LED chip design for white conversionANDREWS PETER S·Filed 2007·Granted Jul 26, 2016·0 cites·21 claims
- 1145US9240526B2Solid state light emitting diode packages with leadframes and ceramic materialANDREWS PETER S·Filed 2010·Granted Jan 19, 2016·0 cites·16 claims
- 1239US2012007117A1Submount for Electronic Die Attach with Controlled Voids and Methods of Attaching an Electronic Die to a Submount Including Engineered VoidsANDREWS PETER S·Filed 2011·Application pending·0 cites
- 1337US2013273238A1Inverted Curing of Liquid Optoelectronic LensesANDREWS PETER S·Filed 2012·Application pending·0 cites
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