Assignee
ANO KAZUAKI
JP·1 granted patent·2 pending applications·7 citations·filing 2008–2008
Top patents by PatentIndex Score
3 records- 0168US8310069B2Semiconductor package having marking layerANO KAZUAKI·Filed 2008·Granted Nov 13, 2012·7 cites·11 claims
- 0240US2009236715A1Semiconductor package structure with laminated interposing layerANO KAZUAKI·Filed 2008·Application pending·0 cites
- 0337US2008230880A1Leadframe Array with Riveted Heat SinksANO KAZUAKI·Filed 2008·Application pending·0 cites
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