Assignee
AOKI DAIGO
JP·3 granted patents·1 pending application·2 citations·filing 2007–2012
Top patents by PatentIndex Score
4 records- 0158US8567255B2Semiconductor pressure sensor having a recess with a larger area than a planar shape of a diaphragmAOKI DAIGO·Filed 2011·Granted Oct 29, 2013·2 cites·9 claims
- 0255US8149540B2Magnetic head structure with diagonal of rectangular-shaped height monitor extending along track width directionAOKI DAIGO·Filed 2007·Granted Apr 3, 2012·0 cites·8 claims
- 0350US2007190885A1Method of producing electroluminescent elementAOKI DAIGO·Filed 2007·Application pending·0 cites
- 0440US8546948B2Silicon structure having bonding padAOKI DAIGO·Filed 2012·Granted Oct 1, 2013·0 cites·3 claims
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