Assignee
AOYAGI NOBUYUKI
JP·3 granted patents·5 citations·filing 2010–2011
Top patents by PatentIndex Score
3 records- 0167US8800843B2Bonding apparatusAOYAGI NOBUYUKI·Filed 2010·Granted Aug 12, 2014·3 cites·16 claims
- 0257US8181527B2Method and apparatus for pass/fail determination of bonding and bonding apparatusAOYAGI NOBUYUKI·Filed 2011·Granted May 22, 2012·1 cites·6 claims
- 0356US8540135B2Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the sameAOYAGI NOBUYUKI·Filed 2011·Granted Sep 24, 2013·1 cites·3 claims
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