Assignee
ASADA SHINSUKE
JP·3 granted patents·12 citations·filing 2008–2011
Top patents by PatentIndex Score
3 records- 0176US8749977B2Power semiconductor module and its attachment structureASADA SHINSUKE·Filed 2011·Granted Jun 10, 2014·5 cites·14 claims
- 0275US9129949B2Power semiconductor moduleASADA SHINSUKE·Filed 2011·Granted Sep 8, 2015·5 cites·12 claims
- 0370US8110062B2Welding method and welding apparatus for resin memberASADA SHINSUKE·Filed 2008·Granted Feb 7, 2012·2 cites·8 claims
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