Assignee

ASAI KENGO

JP·1 granted patent·8 citations·filing 2012–2012

Technology mixH01L1 H03F1 H03H1 H04B1 H10D1 H10N1

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0184US9299914B2Semiconductor device, manufacturing method of the same, and mobile phoneASAI KENGO·Filed 2012·Granted Mar 29, 2016·8 cites·24 claims

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