Assignee
ASE ELECTRONICS M SDN BHD
MY·3 granted patents·139 citations·filing 2003–2016
Top patents by PatentIndex Score
3 records- 0190US6940182B2Flip-chip package with underfill dam for stress controlASE ELECTRONICS M SDN BHD·Filed 2004·Granted Sep 6, 2005·75 cites·16 claims
- 0286US9722098B1Semiconductor device package and method of manufacturing the sameASE ELECTRONICS (M) SDN BHD·Filed 2016·Granted Aug 1, 2017·45 cites·20 claims
- 0360US6773828B1Surface preparation to eliminate whisker growth caused by plating process interruptionsASE ELECTRONICS M SDN BHD·Filed 2003·Granted Aug 10, 2004·19 cites·19 claims
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