Assignee
ASM NUTOOL INC
US·43 granted patents·3 pending applications·2,368 citations·filing 2001–2007
Top patents by PatentIndex Score
46 records- 0199US7172497B2Fabrication of semiconductor interconnect structuresASM NUTOOL INC·Filed 2002·Granted Feb 6, 2007·551 cites·16 claims
- 0299US7147766B2Chip interconnect and packaging deposition methods and structuresASM NUTOOL INC·Filed 2003·Granted Dec 12, 2006·554 cites·30 claims
- 0399US7129165B2Method and structure to improve reliability of copper interconnectsASM NUTOOL INC·Filed 2004·Granted Oct 31, 2006·559 cites·21 claims
- 0496US6942780B2Method and apparatus for processing a substrate with minimal edge exclusionASM NUTOOL INC·Filed 2003·Granted Sep 13, 2005·45 cites·32 claims
- 0595US6902659B2Method and apparatus for electro-chemical mechanical depositionASM NUTOOL INC·Filed 2002·Granted Jun 7, 2005·73 cites·37 claims
- 0693US6852630B2Electroetching process and systemASM NUTOOL INC·Filed 2001·Granted Feb 8, 2005·73 cites·23 claims
- 0793US6837979B2Method and apparatus for depositing and controlling the texture of a thin filmASM NUTOOL INC·Filed 2002·Granted Jan 4, 2005·60 cites·9 claims
- 0891US6958114B2Method and apparatus for forming an electrical contact with a semiconductor substrateASM NUTOOL INC·Filed 2002·Granted Oct 25, 2005·37 cites·28 claims
- 0991US6857947B2Advanced chemical mechanical polishing system with smart endpoint detectionASM NUTOOL INC·Filed 2003·Granted Feb 22, 2005·43 cites·49 claims
- 1088US6921551B2Plating method and apparatus for controlling deposition on predetermined portions of a workpieceASM NUTOOL INC·Filed 2001·Granted Jul 26, 2005·31 cites·33 claims
- 1186US6974769B2Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallizationASM NUTOOL INC·Filed 2003·Granted Dec 13, 2005·42 cites·15 claims
- 1285US6939206B2Method and apparatus of sealing wafer backside for full-face electrochemical platingASM NUTOOL INC·Filed 2002·Granted Sep 6, 2005·33 cites·48 claims
- 1385US6905588B2Packaging deposition methodsASM NUTOOL INC·Filed 2001·Granted Jun 14, 2005·12 cites·7 claims
- 1482US7485561B2Filling deep features with conductors in semiconductor manufacturingASM NUTOOL INC·Filed 2006·Granted Feb 3, 2009·7 cites·21 claims
- 1582US6946066B2Multi step electrodeposition process for reducing defects and minimizing film thicknessASM NUTOOL INC·Filed 2002·Granted Sep 20, 2005·22 cites·22 claims
- 1682US6943112B2Defect-free thin and planar film processingASM NUTOOL INC·Filed 2003·Granted Sep 13, 2005·22 cites·14 claims
- 1782US6936154B2Planarity detection methods and apparatus for electrochemical mechanical processing systemsASM NUTOOL INC·Filed 2001·Granted Aug 30, 2005·26 cites·32 claims
- 1881US6942546B2Endpoint detection for non-transparent polishing memberASM NUTOOL INC·Filed 2002·Granted Sep 13, 2005·23 cites·20 claims
- 1979US7097538B2Advanced chemical mechanical polishing system with smart endpoint detectionASM NUTOOL INC·Filed 2004·Granted Aug 29, 2006·16 cites·20 claims
- 2078US6988932B2Apparatus of sealing wafer backside for full-face processingASM NUTOOL INC·Filed 2004·Granted Jan 24, 2006·18 cites·27 claims
- 2177US7029567B2Electrochemical edge and bevel cleaning process and systemASM NUTOOL INC·Filed 2002·Granted Apr 18, 2006·19 cites·36 claims
- 2277US6866763B2Method and system monitoring and controlling film thickness profile during plating and electroetchingASM NUTOOL INC·Filed 2003·Granted Mar 15, 2005·19 cites·31 claims
- 2375US7045040B2Process and system for eliminating gas bubbles during electrochemical processingASM NUTOOL INC·Filed 2003·Granted May 16, 2006·8 cites·10 claims
- 2475US6855037B2Method of sealing wafer backside for full-face electrochemical platingASM NUTOOL INC·Filed 2001·Granted Feb 15, 2005·15 cites·38 claims
- 2569US7189146B2Method for reduction of defects in wet processed layersASM NUTOOL INC·Filed 2003·Granted Mar 13, 2007·9 cites·30 claims
- 2668US6821409B2Electroetching methods and systems using chemical and mechanical influenceASM NUTOOL INC·Filed 2002·Granted Nov 23, 2004·10 cites·40 claims
- 2763US7625814B2Filling deep features with conductors in semiconductor manufacturingASM NUTOOL INC·Filed 2007·Granted Dec 1, 2009·1 cites·38 claims
- 2861US6861354B2Method and structure to reduce defects in integrated circuits and substratesASM NUTOOL INC·Filed 2003·Granted Mar 1, 2005·7 cites·17 claims
- 2957US7141146B2Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surfaceASM NUTOOL INC·Filed 2004·Granted Nov 28, 2006·6 cites·8 claims
- 3057US6967166B2Method for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processingASM NUTOOL INC·Filed 2002·Granted Nov 22, 2005·5 cites·39 claims
- 3156US6953392B2Integrated system for processing semiconductor wafersASM NUTOOL INC·Filed 2001·Granted Oct 11, 2005·4 cites·40 claims
- 3256US2009065365A1Method and apparatus for copper electroplatingASM NUTOOL INC·Filed 2007·Application pending·0 cites
- 3354US7115510B2Method for electrochemically processing a workpieceASM NUTOOL INC·Filed 2004·Granted Oct 3, 2006·3 cites·11 claims
- 3454US7059944B2Integrated system for processing semiconductor wafersASM NUTOOL INC·Filed 2003·Granted Jun 13, 2006·3 cites·16 claims
- 3553US6932679B2Apparatus and method for loading a wafer in polishing systemASM NUTOOL INC·Filed 2002·Granted Aug 23, 2005·3 cites·24 claims
- 3653US6884334B2Vertically configured chamber used for multiple processesASM NUTOOL INC·Filed 2001·Granted Apr 26, 2005·3 cites·20 claims
- 3752US6969456B2Method of using vertically configured chamber used for multiple processesASM NUTOOL INC·Filed 2001·Granted Nov 29, 2005·2 cites·28 claims
- 3851US7097755B2Electrochemical mechanical processing with advancible sweeperASM NUTOOL INC·Filed 2002·Granted Aug 29, 2006·3 cites·45 claims
- 3945US2008242078A1Process of filling deep vias for 3-d integration of substratesASM NUTOOL INC·Filed 2007·Application pending·0 cites
- 4044US7122473B2Edge and bevel cleaning process and systemASM NUTOOL INC·Filed 2004·Granted Oct 17, 2006·0 cites·15 claims
- 4143US2007131563A1Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surfaceASM NUTOOL INC·Filed 2006·Application pending·0 cites
- 4240US6939203B2Fluid bearing slide assembly for workpiece polishingASM NUTOOL INC·Filed 2003·Granted Sep 6, 2005·0 cites·23 claims
- 4339US7064057B2Method and apparatus for localized material removal by electrochemical polishingASM NUTOOL INC·Filed 2003·Granted Jun 20, 2006·0 cites·31 claims
- 4438US6908368B2Advanced Bi-directional linear polishing system and methodASM NUTOOL INC·Filed 2003·Granted Jun 21, 2005·0 cites·17 claims
- 4535US6926589B2Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishingASM NUTOOL INC·Filed 2002·Granted Aug 9, 2005·0 cites·24 claims
- 4629US7101471B2Method for planar material removal technique using multi-phase process environmentASM NUTOOL INC·Filed 2003·Granted Sep 5, 2006·1 cites·36 claims
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