Assignee
BACHMAN MARK A
US·4 granted patents·77 citations·filing 2010–2011
Top patents by PatentIndex Score
4 records- 0196US8492911B2Stacked interconnect heat sinkBACHMAN MARK A·Filed 2010·Granted Jul 23, 2013·34 cites·7 claims
- 0295US8987137B2Method of fabrication of through-substrate viasBACHMAN MARK A·Filed 2010·Granted Mar 24, 2015·25 cites·18 claims
- 0391US8742535B2Integration of shallow trench isolation and through-substrate vias into integrated circuit designsBACHMAN MARK A·Filed 2010·Granted Jun 3, 2014·13 cites·9 claims
- 0482US8507317B2Solder bump structure for flip chip semiconductor devices and method of manufacturing thereforeBACHMAN MARK A·Filed 2011·Granted Aug 13, 2013·5 cites·7 claims
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