Assignee
BAI ZHIGANG
CN·21 granted patents·3 pending applications·876 citations·filing 2008–2014
Top patents by PatentIndex Score
24 records- 0199US8547659B1System for providing a transducer having a main coil and an additional coil separated from the main pole by a write shieldBAI ZHIGANG·Filed 2011·Granted Oct 1, 2013·163 cites·22 claims
- 0299US8259410B1Method and system for providing a magnetic head using a composite magnetic material in the recording transducerBAI ZHIGANG·Filed 2008·Granted Sep 4, 2012·156 cites·34 claims
- 0399US8179636B1Method and system for providing a perpendicular magnetic recording writerBAI ZHIGANG·Filed 2008·Granted May 15, 2012·162 cites·24 claims
- 0498US8797686B1Magnetic recording transducer with short effective throat height and method of fabricationBAI ZHIGANG·Filed 2010·Granted Aug 5, 2014·148 cites·14 claims
- 0597US8264792B2PMR writer device with multi-level tapered write poleBAI ZHIGANG·Filed 2009·Granted Sep 11, 2012·80 cites·5 claims
- 0696US8547661B2MAMR head with self-aligned write element and microwave field generatorBAI ZHIGANG·Filed 2009·Granted Oct 1, 2013·31 cites·9 claims
- 0796US8125732B2Tapered PMR write pole with straight side wall portionBAI ZHIGANG·Filed 2009·Granted Feb 28, 2012·34 cites·20 claims
- 0895US8134802B2Writer and reader arrangements for shingled writingBAI ZHIGANG·Filed 2009·Granted Mar 13, 2012·27 cites·39 claims
- 0990US8542461B2Writer shields with modified shapes for reduced flux shuntingBAI ZHIGANG·Filed 2010·Granted Sep 24, 2013·15 cites·29 claims
- 1088US8901721B1Lead frame based semiconductor die packageBAI ZHIGANG·Filed 2013·Granted Dec 2, 2014·12 cites·20 claims
- 1188US8085498B2PMR write with flux choking areaBAI ZHIGANG·Filed 2009·Granted Dec 27, 2011·9 cites·25 claims
- 1286US8670212B2PMR writer device with multi-level tapered write poleBAI ZHIGANG·Filed 2012·Granted Mar 11, 2014·6 cites·5 claims
- 1385US8859339B2Mold chaseBAI ZHIGANG·Filed 2013·Granted Oct 14, 2014·7 cites·18 claims
- 1485US8525311B2Lead frame for semiconductor deviceBAI ZHIGANG·Filed 2011·Granted Sep 3, 2013·8 cites·18 claims
- 1581US8105705B2External field robustness of read/write head shieldsBAI ZHIGANG·Filed 2009·Granted Jan 31, 2012·4 cites·19 claims
- 1680US8842389B2Wrap-around shielded writer with highly homogeneous shield materialBAI ZHIGANG·Filed 2009·Granted Sep 23, 2014·3 cites·10 claims
- 1777US9589928B2Combined QFN and QFP semiconductor packageBAI ZHIGANG·Filed 2014·Granted Mar 7, 2017·4 cites·19 claims
- 1871US9105287B2Method of forming a PMR writer device with multi-level tapered write poleBAI ZHIGANG·Filed 2012·Granted Aug 11, 2015·2 cites·7 claims
- 1969US9214447B2Non-leaded type semiconductor package and method of assembling sameBAI ZHIGANG·Filed 2014·Granted Dec 15, 2015·2 cites·12 claims
- 2068US8209848B2Method of making a PMR writer with seamless shieldsBAI ZHIGANG·Filed 2010·Granted Jul 3, 2012·2 cites·12 claims
- 2162US9443746B2Floating mold tool for semicondcutor packagingBAI ZHIGANG·Filed 2014·Granted Sep 13, 2016·1 cites·5 claims
- 2246US2015294929A1Semiconductor die package and method of assembling sameBAI ZHIGANG·Filed 2014·Application pending·0 cites
- 2345US2016056097A1Semiconductor device with inspectable solder jointsBAI ZHIGANG·Filed 2014·Application pending·0 cites
- 2443US2015097278A1Surface mount semiconductor device with additional bottom face contactsBAI ZHIGANG·Filed 2014·Application pending·0 cites
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