Assignee
BAKSHI ABHAYA KUMAR
US·2 granted patents·1 pending application·25 citations·filing 2008–2009
Top patents by PatentIndex Score
3 records- 0183US8065995B2Method and apparatus for cutting and cleaning wafers in a wire sawBAKSHI ABHAYA KUMAR·Filed 2009·Granted Nov 29, 2011·18 cites·24 claims
- 0278US8261730B2In-situ wafer processing system and methodBAKSHI ABHAYA KUMAR·Filed 2009·Granted Sep 11, 2012·7 cites·30 claims
- 0345US2010126488A1Method and apparatus for cutting wafers by wire sawingBAKSHI ABHAYA KUMAR·Filed 2008·Application pending·0 cites
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