Assignee
BATHAN HENRY DESCALZO
SG·17 granted patents·1 pending application·47 citations·filing 2007–2012
Top patents by PatentIndex Score
18 records- 0189US8193037B1Integrated circuit packaging system with pad connection and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2010·Granted Jun 5, 2012·11 cites·11 claims
- 0281US8273602B2Integrated circuit package system with integration portBATHAN HENRY DESCALZO·Filed 2008·Granted Sep 25, 2012·9 cites·20 claims
- 0381US8203214B2Integrated circuit package in package system with adhesiveless package attachBATHAN HENRY DESCALZO·Filed 2007·Granted Jun 19, 2012·7 cites·20 claims
- 0480US8241965B2Integrated circuit packaging system with pad connection and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2010·Granted Aug 14, 2012·5 cites·20 claims
- 0579US8803300B2Integrated circuit packaging system with protective coating and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2010·Granted Aug 12, 2014·5 cites·16 claims
- 0672US8592252B2Semiconductor device and method of forming through hole vias in die extension region around periphery of dieBATHAN HENRY DESCALZO·Filed 2010·Granted Nov 26, 2013·2 cites·25 claims
- 0768US8304337B2Integrated circuit packaging system with bond wire pads and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2009·Granted Nov 6, 2012·3 cites·20 claims
- 0867US8236607B2Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2009·Granted Aug 7, 2012·3 cites·20 claims
- 0960US8802555B2Integrated circuit packaging system with interconnects and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2011·Granted Aug 12, 2014·1 cites·20 claims
- 1058US8207600B2Integrated circuit package system with encapsulating featuresBATHAN HENRY DESCALZO·Filed 2007·Granted Jun 26, 2012·1 cites·20 claims
- 1151US8399991B2Semiconductor device and method of forming through hole vias in die extension region around periphery of dieBATHAN HENRY DESCALZO·Filed 2010·Granted Mar 19, 2013·0 cites·25 claims
- 1251US8252666B2Semiconductor device and method of forming through hole vias in die extension region around periphery of dieBATHAN HENRY DESCALZO·Filed 2010·Granted Aug 28, 2012·0 cites·24 claims
- 1349US8106502B2Integrated circuit packaging system with plated pad and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2008·Granted Jan 31, 2012·0 cites·20 claims
- 1448US8569872B2Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolationBATHAN HENRY DESCALZO·Filed 2008·Granted Oct 29, 2013·0 cites·20 claims
- 1547US8937393B2Integrated circuit package system with device cavityBATHAN HENRY DESCALZO·Filed 2007·Granted Jan 20, 2015·0 cites·10 claims
- 1647US8723338B2Integrated circuit packaging system with array contacts and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2012·Granted May 13, 2014·0 cites·20 claims
- 1742US9034692B2Integrated circuit packaging system with a flip chip and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2011·Granted May 19, 2015·0 cites·20 claims
- 1838US2011108966A1Integrated circuit packaging system with concave trenches and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2010·Application pending·0 cites
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