Assignee
BELANGER LUC
CA·1 granted patent·2 pending applications·4 citations·filing 2004–2012
Top patents by PatentIndex Score
3 records- 0165US8314500B2Interconnections for flip-chip using lead-free solders and having improved reaction barrier layersBELANGER LUC·Filed 2006·Granted Nov 20, 2012·4 cites·1 claims
- 0242US2012202343A1Method of forming underbump metallurgy structure employing sputter-deposited nickel copper alloyBELANGER LUC·Filed 2012·Application pending·0 cites
- 0334US2005263571A1Injection molded continuously solidified solder method and apparatusBELANGER LUC·Filed 2004·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →