Assignee
BENSON ERIC
US·2 granted patents·2 pending applications·15 citations·filing 2007–2021
Top patents by PatentIndex Score
4 records- 0186US8227723B2Solder bonding method and apparatusBENSON ERIC·Filed 2009·Granted Jul 24, 2012·11 cites·17 claims
- 0261US8970393B2Data analysis system, such as a theft scenario analysis system for automated utility meteringBENSON ERIC·Filed 2007·Granted Mar 3, 2015·4 cites·29 claims
- 0343US2023056717A1Fluid Containment Covering for Pipe LeaksBENSON ERIC·Filed 2021·Application pending·0 cites
- 0435US2011285840A1Solder bonding and inspection method and apparatusBENSON ERIC·Filed 2010·Application pending·0 cites
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