Assignee
BESI NETHERLANDS BV
NL·15 granted patents·3 pending applications·2 citations·filing 2013–2025
Top patents by PatentIndex Score
18 records- 0174US2025353226A1Method and Mould for Encapsulating Electronic Components Mounted on a CarrierBESI NETHERLANDS BV·Filed 2025·Application pending·0 cites
- 0267US11217463B2Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuatorsBESI NETHERLANDS BV·Filed 2016·Granted Jan 4, 2022·2 cites·13 claims
- 0360US12420465B2Method and mould for encapsulating electronic components mounted on a carrierBESI NETHERLANDS BV·Filed 2021·Granted Sep 23, 2025·0 cites·6 claims
- 0457US11842909B2Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuatorsBESI NETHERLANDS BV·Filed 2021·Granted Dec 12, 2023·0 cites·8 claims
- 0554US2025100190A1Device and Method for Detecting and Removing Contaminants on a Mould for Encapsulating Electronic ComponentsBESI NETHERLANDS BV·Filed 2024·Application pending·0 cites
- 0650US11554523B2Press part for supporting a mould part for encapsulating electronic components mounted on a carrier and a press comprising the press partBESI NETHERLANDS BV·Filed 2018·Granted Jan 17, 2023·0 cites·18 claims
- 0749US10720340B2Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic componentsBESI NETHERLANDS BV·Filed 2018·Granted Jul 21, 2020·0 cites·10 claims
- 0847US2025178847A1Gripper Head, Device, and Method for Handling and Varying the Spacing of Electronic Components Arranged in a Matrix StructureBESI NETHERLANDS BV·Filed 2023·Application pending·0 cites
- 0944US12384081B2Mould half and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using suchBESI NETHERLANDS BV·Filed 2019·Granted Aug 12, 2025·0 cites·18 claims
- 1044US10032653B2Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic componentsBESI NETHERLANDS BV·Filed 2014·Granted Jul 24, 2018·0 cites·8 claims
- 1142US9831105B2Method for moulding and surface processing electronic components and electronic component produced with this methodBESI NETHERLANDS BV·Filed 2014·Granted Nov 28, 2017·0 cites·12 claims
- 1241US11935764B2Sawing device and method for forming saw-cuts into a semiconductor productBESI NETHERLANDS BV·Filed 2021·Granted Mar 19, 2024·0 cites·18 claims
- 1341US10913191B2Mould, moulding apparatus and method for controlled overmoulding of a carrier with electronic components and moulded productBESI NETHERLANDS BV·Filed 2015·Granted Feb 9, 2021·0 cites·7 claims
- 1440US11887872B2Method and device for selectively separating electronic components from a frame with electronic componentsBESI NETHERLANDS BV·Filed 2019·Granted Jan 30, 2024·0 cites·23 claims
- 1540US11450550B2Handler device for handling substratesBESI NETHERLANDS BV·Filed 2019·Granted Sep 20, 2022·0 cites·20 claims
- 1640US10217679B2Method for positioning a carrier with electronic components and electronic component produced with such methodBESI NETHERLANDS BV·Filed 2014·Granted Feb 26, 2019·0 cites·11 claims
- 1740US9435584B2Device and method for separating, at least partially drying and inspecting electronic componentsBESI NETHERLANDS BV·Filed 2013·Granted Sep 6, 2016·0 cites·15 claims
- 1831US10699924B2Modular system for moulding electronic components and kit-of-parts for assembling such a modular systemBESI NETHERLANDS BV·Filed 2016·Granted Jun 30, 2020·0 cites·17 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →