Assignee
BONDTECH INC
JP·2 granted patents·1 pending application·21 citations·filing 2004–2005
Top patents by PatentIndex Score
3 records- 0181US7784670B2Joining method and device produced by this method and joining unitBONDTECH INC·Filed 2005·Granted Aug 31, 2010·11 cites·23 claims
- 0260US7645681B2Bonding method, device produced by this method, and bonding deviceBONDTECH INC·Filed 2004·Granted Jan 12, 2010·10 cites·22 claims
- 0332US2007110917A1Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unitBONDTECH INC·Filed 2004·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →