Assignee
BOON SUAN JEUNG
SG·4 granted patents·16 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0184US8629054B2Packaged semiconductor assemblies and methods for manufacturing such assembliesBOON SUAN JEUNG·Filed 2012·Granted Jan 14, 2014·4 cites·13 claims
- 0283US8063493B2Semiconductor device assemblies and packagesBOON SUAN JEUNG·Filed 2009·Granted Nov 22, 2011·9 cites·20 claims
- 0379US8232657B2Packaged semiconductor assemblies and methods for manufacturing such assembliesBOON SUAN JEUNG·Filed 2010·Granted Jul 31, 2012·3 cites·10 claims
- 0453US8445330B2Interconnects for packaged semiconductor devices and methods for manufacturing such devicesBOON SUAN JEUNG·Filed 2012·Granted May 21, 2013·0 cites·20 claims
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