Assignee
BOURNS MULTIFUSE HONG KONG LTD
HK·5 granted patents·189 citations·filing 1997–1999
Top patents by PatentIndex Score
5 records- 0186US5802709AMethod for manufacturing surface mount conductive polymer devicesBOURNS MULTIFUSE HONG KONG LTD·Filed 1997·Granted Sep 8, 1998·77 cites·15 claims
- 0283US6020808AMultilayer conductive polymer positive temperature coefficent deviceBOURNS MULTIFUSE HONG KONG LTD·Filed 1997·Granted Feb 1, 2000·47 cites·9 claims
- 0371US6223423B1Multilayer conductive polymer positive temperature coefficient deviceBOURNS MULTIFUSE HONG KONG LTD·Filed 1999·Granted May 1, 2001·27 cites·5 claims
- 0463US5849129AContinuous process and apparatus for manufacturing conductive polymer componentsBOURNS MULTIFUSE HONG KONG LTD·Filed 1997·Granted Dec 15, 1998·22 cites·19 claims
- 0554US5849137AContinuous process and apparatus for manufacturing conductive polymer componentsBOURNS MULTIFUSE HONG KONG LTD·Filed 1997·Granted Dec 15, 1998·16 cites·10 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →