Assignee
BRENNAN JOHN M
0 granted patents·3 pending applications·0 citations·filing 2004–2005
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0138US2006108672A1Die bonded device and method for transistor packagesBRENNAN JOHN M·Filed 2004·Application pending·0 cites
- 0238US2006170079A1Integrated circuit device having encapsulant dam with chamfered edgeBRENNAN JOHN M·Filed 2005·Application pending·0 cites
- 0337US2006145317A1Leadframe designs for plastic cavity transistor packagesBRENNAN JOHN M·Filed 2004·Application pending·0 cites
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