Assignee
CARPENTER BURTON J
US·6 granted patents·2 pending applications·53 citations·filing 2007–2014
Top patents by PatentIndex Score
8 records- 0196US9437459B2Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structureCARPENTER BURTON J·Filed 2014·Granted Sep 6, 2016·41 cites·13 claims
- 0281US8674509B2Integrated circuit die assembly with heat spreaderCARPENTER BURTON J·Filed 2012·Granted Mar 18, 2014·6 cites·16 claims
- 0376US8754521B1Semiconductor device assembly having a heat spreaderCARPENTER BURTON J·Filed 2013·Granted Jun 17, 2014·4 cites·17 claims
- 0459US8754518B1Devices and methods for configuring conductive elements for a semiconductor packageCARPENTER BURTON J·Filed 2013·Granted Jun 17, 2014·2 cites·16 claims
- 0549US9324675B2Structures for reducing corrosion in wire bondsCARPENTER BURTON J·Filed 2014·Granted Apr 26, 2016·0 cites·10 claims
- 0643US2016064316A1Package substrate with improved reliabilityCARPENTER BURTON J·Filed 2014·Application pending·0 cites
- 0743US2008182398A1Varied Solder Mask Opening Diameters Within a Ball Grid Array SubstrateCARPENTER BURTON J·Filed 2007·Application pending·0 cites
- 0842US8802508B2Semiconductor device packageCARPENTER BURTON J·Filed 2012·Granted Aug 12, 2014·0 cites·21 claims
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