Assignee
CARSON FLYNN
US·2 granted patents·26 citations·filing 2007–2010
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0194US8067268B2Stacked integrated circuit package system and method for manufacturing thereofCARSON FLYNN·Filed 2010·Granted Nov 29, 2011·26 cites·15 claims
- 0245US8129832B2Mountable integrated circuit package system with substrate having a conductor-free recessCARSON FLYNN·Filed 2007·Granted Mar 6, 2012·0 cites·18 claims
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