Assignee
CASEY JON A
US·3 granted patents·51 citations·filing 2008–2012
Top patents by PatentIndex Score
3 records- 0192US8421217B2Achieving mechanical and thermal stability in a multi-chip packageCASEY JON A·Filed 2012·Granted Apr 16, 2013·19 cites·19 claims
- 0292US8202765B2Achieving mechanical and thermal stability in a multi-chip packageCASEY JON A·Filed 2009·Granted Jun 19, 2012·28 cites·22 claims
- 0368US8214658B2Enhanced thermal management for improved module reliabilityCASEY JON A·Filed 2008·Granted Jul 3, 2012·4 cites·22 claims
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