Assignee
CATLAM LLC
US·11 granted patents·1 pending application·2 citations·filing 2016–2023
Top patents by PatentIndex Score
12 records- 0189US11638354B2Process for fabrication of a printed circuit board using a semi-additive process and removable backing foilCATLAM LLC·Filed 2020·Granted Apr 25, 2023·2 cites·16 claims
- 0279US12513827B2Semi-additive process for catalytic printed circuit boardsCATLAM LLC·Filed 2023·Granted Dec 30, 2025·0 cites·8 claims
- 0375US11406024B2Multi-layer circuit board with traces thicker than a circuit boardCATLAM LLC·Filed 2021·Granted Aug 2, 2022·0 cites·18 claims
- 0474US11039540B2Multi-layer circuit board with traces thicker than a circuit board layerCATLAM LLC·Filed 2019·Granted Jun 15, 2021·0 cites·18 claims
- 0572US11477893B2Catalytic laminate with conductive traces formed during laminationCATLAM LLC·Filed 2020·Granted Oct 18, 2022·0 cites·18 claims
- 0671US10959329B2Circuit board using non-catalytic laminate with catalytic adhesive overlayCATLAM LLC·Filed 2020·Granted Mar 23, 2021·0 cites·29 claims
- 0767US11653453B2Electroless and electrolytic deposition process for forming traces on a catalytic laminateCATLAM LLC·Filed 2020·Granted May 16, 2023·0 cites·21 claims
- 0864US10806029B2Catalytic circuit board with traces and viasCATLAM LLC·Filed 2019·Granted Oct 13, 2020·0 cites·29 claims
- 0961US10765003B2Method for making a multi-layer circuit board using conductive paste with interposer layerCATLAM LLC·Filed 2019·Granted Sep 1, 2020·0 cites·21 claims
- 1051US10685931B2Method and apparatus for forming contacts on an integrated circuit die using a catalytic adhesiveCATLAM LLC·Filed 2018·Granted Jun 16, 2020·0 cites·17 claims
- 1151US2023096301A1Circuit Board Traces in Channels using Electroless and Electroplated DepositionsCATLAM LLC·Filed 2021·Application pending·0 cites
- 1237US10573610B2Method for wafer level packagingCATLAM LLC·Filed 2016·Granted Feb 25, 2020·0 cites·18 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →