Assignee
CHAN CHANG-YUEH
TW·5 granted patents·24 citations·filing 2008–2012
Top patents by PatentIndex Score
5 records- 0194US8154115B1Package structure having MEMS element and fabrication method thereofCHAN CHANG-YUEH·Filed 2011·Granted Apr 10, 2012·16 cites·15 claims
- 0273US8618641B2Leadframe-based semiconductor packageCHAN CHANG-YUEH·Filed 2008·Granted Dec 31, 2013·6 cites·28 claims
- 0367US8198689B2Package structure having micro-electromechanical element and fabrication method thereofCHAN CHANG-YUEH·Filed 2010·Granted Jun 12, 2012·2 cites·9 claims
- 0450US8564115B2Package structure having micro-electromechanical elementCHAN CHANG-YUEH·Filed 2012·Granted Oct 22, 2013·0 cites·8 claims
- 0540US8653661B2Package having MEMS element and fabrication method thereofCHAN CHANG-YUEH·Filed 2011·Granted Feb 18, 2014·0 cites·18 claims
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