Assignee
CHANG CHIANG-CHENG
TW·5 granted patents·6 pending applications·29 citations·filing 2008–2012
Top patents by PatentIndex Score
11 records- 0189US9040361B2Chip scale package with electronic component received in encapsulant, and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Granted May 26, 2015·13 cites·23 claims
- 0280US8680692B2Carrier, semiconductor package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2012·Granted Mar 25, 2014·5 cites·3 claims
- 0376US8334174B2Chip scale package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Granted Dec 18, 2012·6 cites·9 claims
- 0467US8304665B2Package substrate having landless conductive tracesCHANG CHIANG-CHENG·Filed 2008·Granted Nov 6, 2012·3 cites·12 claims
- 0565US8525348B2Chip scale package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Granted Sep 3, 2013·2 cites·19 claims
- 0647US2013228915A1Semiconductor package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2012·Application pending·0 cites
- 0737US2012001328A1Chip-sized package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Application pending·0 cites
- 0837US2012061825A1Chip scale package and method of fabricating the sameCHANG CHIANG-CHENG·Filed 2010·Application pending·0 cites
- 0937US2012086117A1Package with embedded chip and method of fabricating the sameCHANG CHIANG-CHENG·Filed 2010·Application pending·0 cites
- 1037US2012013006A1Chip scale package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Application pending·0 cites
- 1137US2012313243A1Chip-scale packageCHANG CHIANG-CHENG·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →