Assignee
CHANG CHIEN PAO-HUEI
TW·4 granted patents·1 pending application·96 citations·filing 2008–2010
Technology mixH10W5
Top patents by PatentIndex Score
5 records- 0193US8120152B2Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereofCHANG CHIEN PAO-HUEI·Filed 2008·Granted Feb 21, 2012·26 cites·24 claims
- 0289US8106492B2Semiconductor package and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2009·Granted Jan 31, 2012·25 cites·21 claims
- 0388US8124447B2Manufacturing method of advanced quad flat non-leaded packageCHANG CHIEN PAO-HUEI·Filed 2009·Granted Feb 28, 2012·24 cites·29 claims
- 0487US8237250B2Advanced quad flat non-leaded package structure and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2009·Granted Aug 7, 2012·21 cites·20 claims
- 0535US2012119342A1Advanced quad flat non-leaded package structure and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →