Assignee
CHANG HSIAO-CHUAN
TW·4 granted patents·1 pending application·17 citations·filing 2009–2010
Top patents by PatentIndex Score
5 records- 0189US8274149B2Semiconductor device package having a buffer structure and method of fabricating the sameCHANG HSIAO-CHUAN·Filed 2010·Granted Sep 25, 2012·14 cites·14 claims
- 0262US8421242B2Semiconductor packageCHANG HSIAO-CHUAN·Filed 2009·Granted Apr 16, 2013·2 cites·6 claims
- 0355US8110931B2Wafer and semiconductor packageCHANG HSIAO CHUAN·Filed 2009·Granted Feb 7, 2012·1 cites·21 claims
- 0440US2011156739A1Test kit for testing a chip subassembly and a testing method by using the sameCHANG HSIAO-CHUAN·Filed 2009·Application pending·0 cites
- 0538US8222726B2Semiconductor device package having a jumper chip and method of fabricating the sameCHANG HSIAO-CHUAN·Filed 2010·Granted Jul 17, 2012·0 cites·16 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →