Assignee
CHANG HUNG-PIN
TW·6 granted patents·2 pending applications·96 citations·filing 2008–2012
Top patents by PatentIndex Score
8 records- 0195US8513119B2Method of forming bump structure having tapered sidewalls for stacked diesCHANG HUNG-PIN·Filed 2008·Granted Aug 20, 2013·35 cites·12 claims
- 0295US8466059B2Multi-layer interconnect structure for stacked diesCHANG HUNG-PIN·Filed 2010·Granted Jun 18, 2013·32 cites·19 claims
- 0388US8853830B2System, structure, and method of manufacturing a semiconductor substrate stackCHANG HUNG-PIN·Filed 2008·Granted Oct 7, 2014·12 cites·30 claims
- 0487US8319336B2Reduction of etch microloading for through silicon viasCHANG HUNG-PIN·Filed 2010·Granted Nov 27, 2012·8 cites·20 claims
- 0583US8841773B2Multi-layer interconnect structure for stacked diesCHANG HUNG-PIN·Filed 2012·Granted Sep 23, 2014·6 cites·20 claims
- 0674US8329578B2Via structure and via etching process of forming the sameCHANG HUNG-PIN·Filed 2010·Granted Dec 11, 2012·3 cites·20 claims
- 0751US2010171197A1Isolation Structure for Stacked DiesCHANG HUNG-PIN·Filed 2009·Application pending·0 cites
- 0838US2012068218A1Thermally efficient packaging for a photonic deviceCHANG HUNG-PIN·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →