Assignee

CHANG KAI-JUN

TW·2 granted patents·33 citations·filing 2011–2012

Technology mixG01R1 H10P1 H10W1

Top patents by PatentIndex Score

2 records

0184US8703508B2Method for wafer-level testing diced multi-chip stacked packagesCHANG KAI-JUN·Filed 2012·Granted Apr 22, 2014·22 cites·15 claims
0283US8710859B2Method for testing multi-chip stacked packagesCHANG KAI-JUN·Filed 2011·Granted Apr 29, 2014·11 cites·9 claims

Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →