Assignee
CHANG TIEN-CHANG
TW·4 granted patents·1 pending application·26 citations·filing 2008–2012
Top patents by PatentIndex Score
5 records- 0183US8242586B2Integrated circuit chip with seal ring structureCHANG TIEN-CHANG·Filed 2009·Granted Aug 14, 2012·12 cites·16 claims
- 0282US8138616B2Bond pad structureCHANG TIEN-CHANG·Filed 2008·Granted Mar 20, 2012·12 cites·22 claims
- 0360US8587090B2Die seal ring structureCHANG TIEN-CHANG·Filed 2012·Granted Nov 19, 2013·1 cites·22 claims
- 0458US8669619B2Semiconductor structure with multi-layer contact etch stop layer structureCHANG TIEN-CHANG·Filed 2010·Granted Mar 11, 2014·1 cites·18 claims
- 0545US2010065943A1Method for including decoupling capacitors into semiconductor circuit having logic circuit therein and semiconductor circuit thereofCHANG TIEN-CHANG·Filed 2008·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →