Assignee

CHANG WEI SEN

TW·3 granted patents·42 citations·filing 2010–2012

Technology mixH10W3

Top patents by PatentIndex Score

3 records

0195US8232193B2Method of forming Cu pillar capped by barrier layerCHANG WEI SEN·Filed 2010·Granted Jul 31, 2012·26 cites·20 claims
0289US8653659B2Integrated circuit device including a copper pillar capped by barrier layerCHANG WEI SEN·Filed 2012·Granted Feb 18, 2014·8 cites·20 claims
0385US8766441B2Methods and apparatus for solder on slot connections in package on package structuresCHANG WEI SEN·Filed 2012·Granted Jul 1, 2014·8 cites·19 claims

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