Assignee
CHASE HAROLD RYAN
US·2 granted patents·3 citations·filing 2012–2014
Top patents by PatentIndex Score
2 records- 0170US9406587B2Substrate conductor structure and methodCHASE HAROLD RYAN·Filed 2012·Granted Aug 2, 2016·2 cites·14 claims
- 0261US9275975B2Electronic package and method of connecting a first die to a second die to form an electronic packageCHASE HAROLD RYAN·Filed 2014·Granted Mar 1, 2016·1 cites·9 claims
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