Assignee
CHEN CHENDER
TW·4 granted patents·15 citations·filing 2008–2011
Top patents by PatentIndex Score
4 records- 0189US8581374B1Placing heat sink into packaging by strip formation assemblyCHEN CHENDER·Filed 2011·Granted Nov 12, 2013·11 cites·19 claims
- 0263US8754513B1Lead frame apparatus and method for improved wire bondingCHEN CHENDER·Filed 2009·Granted Jun 17, 2014·3 cites·7 claims
- 0359US8415785B1Metal ring techniques and configurationsCHEN CHENDER·Filed 2011·Granted Apr 9, 2013·1 cites·20 claims
- 0447US8278563B1Via to plating busCHEN CHENDER·Filed 2008·Granted Oct 2, 2012·0 cites·22 claims
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