Assignee
CHEN JEN YU
TW·2 granted patents·10 citations·filing 2011–2011
Top patents by PatentIndex Score
2 records- 0173US9685402B2Semiconductor device and method of forming recesses in conductive layer to detect continuity for interconnect between semiconductor die and substrateCHEN JEN YU·Filed 2011·Granted Jun 20, 2017·5 cites·24 claims
- 0273US8741764B2Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrateCHEN JEN YU·Filed 2011·Granted Jun 3, 2014·5 cites·25 claims
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