Assignee
CHEN YU-FENG
TW·4 granted patents·18 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0190US9159686B2Crack stopper on under-bump metallization layerCHEN YU-FENG·Filed 2012·Granted Oct 13, 2015·11 cites·20 claims
- 0283US8970033B2Extending metal traces in bump-on-trace structuresCHEN YU-FENG·Filed 2011·Granted Mar 3, 2015·7 cites·17 claims
- 0352US9418947B2Mechanisms for forming connectors with a molding compound for package on packageCHEN YU-FENG·Filed 2012·Granted Aug 16, 2016·0 cites·20 claims
- 0441US8680663B2Methods and apparatus for package on package devices with reduced strainCHEN YU-FENG·Filed 2012·Granted Mar 25, 2014·0 cites·20 claims
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