Assignee

CHEN YU WEI

TW·1 granted patent·6 citations·filing 2018–2018

Technology mixA63H1 G09B1 H02J1 H05K1

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0183US10183227B2Electronic building block set with metal layer on outer surface of each building blockCHEN YU WEI·Filed 2018·Granted Jan 22, 2019·6 cites·23 claims

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