Assignee
CHENGDU ESWIN SIP TECH CO LTD
CN·3 granted patents·5 citations·filing 2018–2019
Top patents by PatentIndex Score
3 records- 0182US11274234B2Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pairCHENGDU ESWIN SIP TECH CO LTD·Filed 2019·Granted Mar 15, 2022·5 cites·4 claims
- 0243US11488931B2Encapsulated fan-in semiconductor package with heat spreader and method of manufacturing the sameCHENGDU ESWIN SIP TECH CO LTD·Filed 2019·Granted Nov 1, 2022·0 cites·17 claims
- 0343US11177153B2Method of debonding work-carrier pair with thin devicesCHENGDU ESWIN SIP TECH CO LTD·Filed 2018·Granted Nov 16, 2021·0 cites·5 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →