Assignee
CHIA KAN-JUNG
TW·3 granted patents·9 citations·filing 2008–2010
Top patents by PatentIndex Score
3 records- 0181US8461689B2Packaging structure having embedded semiconductor elementCHIA KAN-JUNG·Filed 2010·Granted Jun 11, 2013·6 cites·11 claims
- 0263US8058723B2Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereofCHIA KAN-JUNG·Filed 2008·Granted Nov 15, 2011·3 cites·4 claims
- 0346US8129835B2Package substrate having semiconductor component embedded therein and fabrication method thereofCHIA KAN-JUNG·Filed 2009·Granted Mar 6, 2012·0 cites·7 claims
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