Assignee
CHIANG WAN-LAN
TW·3 granted patents·3 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0172US8138597B2Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layerCHIANG WAN-LAN·Filed 2010·Granted Mar 20, 2012·3 cites·11 claims
- 0248US8796840B2Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layersCHIANG WAN-LAN·Filed 2012·Granted Aug 5, 2014·0 cites·9 claims
- 0342US8252633B2Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereofCHIANG WAN-LAN·Filed 2011·Granted Aug 28, 2012·0 cites·10 claims
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