Assignee
CHIMEI CORP
TW·2 granted patents·2 pending applications·1 citations·filing 2018–2024
Top patents by PatentIndex Score
4 records- 0169US2024240010A1Thermoplastic composition and method for producing the same, and molding productCHIMEI CORP·Filed 2024·Application pending·0 cites
- 0264US11106086B2Optical plate with protrusions, optical structure, backlight module and display deviceCHIMEI CORP·Filed 2019·Granted Aug 31, 2021·1 cites·19 claims
- 0362US2025043129A1Thermoplastic resin composition, method for preparing thermoplastic resin composition and use of plastic filmCHIMEI CORP·Filed 2024·Application pending·0 cites
- 0454US11235563B2Resin composition, molded article, food contact appliance and food contact containerCHIMEI CORP·Filed 2018·Granted Feb 1, 2022·0 cites·18 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →