Assignee
CHIN CHEE KEONG
CN·6 granted patents·2 pending applications·43 citations·filing 2006–2010
Top patents by PatentIndex Score
8 records- 0194US8138017B2Integrated circuit package system with through semiconductor vias and method of manufacture thereofCHIN CHEE KEONG·Filed 2010·Granted Mar 20, 2012·24 cites·17 claims
- 0283US8541886B2Integrated circuit packaging system with via and method of manufacture thereofCHIN CHEE KEONG·Filed 2010·Granted Sep 24, 2013·8 cites·11 claims
- 0375US8242607B2Integrated circuit package system with offset stacked die and method of manufacture thereofCHIN CHEE KEONG·Filed 2007·Granted Aug 14, 2012·7 cites·19 claims
- 0461US8946878B2Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture thereforCHIN CHEE KEONG·Filed 2007·Granted Feb 3, 2015·4 cites·9 claims
- 0545US2007284139A1Sawn integrated circuit package systemCHIN CHEE KEONG·Filed 2007·Application pending·0 cites
- 0644US8901439B2Integrated circuit package system with window openingCHIN CHEE KEONG·Filed 2006·Granted Dec 2, 2014·0 cites·20 claims
- 0742US2008237157A1Wafer transport systemCHIN CHEE KEONG·Filed 2007·Application pending·0 cites
- 0841US8288860B2Memory device system with stacked packagesCHIN CHEE KEONG·Filed 2008·Granted Oct 16, 2012·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →