Assignee
CHINA WAFER LEVEL CSP CO LTD
CN·26 granted patents·20 pending applications·22 citations·filing 2014–2018
Top patents by PatentIndex Score
46 records- 0184US10133907B2Fingerprint recognition chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Nov 20, 2018·5 cites·20 claims
- 0276US10276540B2Chip packaging method and chip packaging structureCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Apr 30, 2019·3 cites·17 claims
- 0372US10090217B2Chip packaging method and package structureCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Oct 2, 2018·2 cites·16 claims
- 0470US10541186B2Chip package and chip packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Jan 21, 2020·2 cites·13 claims
- 0569US9748162B2Chip to wafer package with top electrodes and method of formingCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Aug 29, 2017·2 cites·15 claims
- 0668US10763293B2Image sensing chip package and image sensing chip packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Sep 1, 2020·1 cites·18 claims
- 0767US9305961B2Wafer-level packaging method of BSI image sensors having different cutting processesCHINA WAFER LEVEL CSP CO LTD·Filed 2014·Granted Apr 5, 2016·2 cites·4 claims
- 0863US10126151B2Wafer-level chip package structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Nov 13, 2018·1 cites·23 claims
- 0961US10325946B2Packaging method and package structure for image sensing chipCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted Jun 18, 2019·1 cites·15 claims
- 1061US10108837B2Fingerprint recognition chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Oct 23, 2018·1 cites·19 claims
- 1161US9601531B2Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regionsCHINA WAFER LEVEL CSP CO LTD·Filed 2014·Granted Mar 21, 2017·1 cites·8 claims
- 1258US11049899B2Encapsulation structure of image sensing chip, and encapsulation method thereforCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Jun 29, 2021·1 cites·20 claims
- 1347US10817700B2Optical fingerprint recognition chip package and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Oct 27, 2020·0 cites·20 claims
- 1447US10685917B2Semiconductor device and manufacture method of the sameCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Jun 16, 2020·0 cites·13 claims
- 1547US10680033B2Chip packaging method and chip packageCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·25 claims
- 1647US10541264B2Package-on-package structure and package-on-package methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Jan 21, 2020·0 cites·20 claims
- 1747US9231018B2Wafer level packaging structure for image sensors and wafer level packaging method for image sensorsCHINA WAFER LEVEL CSP CO LTD·Filed 2014·Granted Jan 5, 2016·0 cites·18 claims
- 1845US9299735B2Image sensor package structure and methodCHINA WAFER LEVEL CSP CO LTD·Filed 2014·Granted Mar 29, 2016·0 cites·38 claims
- 1944US9455298B2Wafer-level packaging method of BSI image sensors having different cutting processesCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted Sep 27, 2016·0 cites·7 claims
- 2041US2020051938A9Fingerprint chip packaging method and fingerprint chip packageCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Application pending·0 cites
- 2140US2019010046A1Packaging structure and packaging method of mems chip and asic chipCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Application pending·0 cites
- 2239US2019202685A1Chip package and chip packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Application pending·0 cites
- 2338US10283483B2Packaging method and package structure for image sensing chipCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted May 7, 2019·0 cites·15 claims
- 2437US2020243588A1Packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2017·Application pending·0 cites
- 2536US10529758B2Packaging method and packaging structureCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Jan 7, 2020·0 cites·9 claims
- 2636US10497728B2Fingerprint sensing chip packaging method and fingerprint sensing chip packageCHINA WAFER LEVEL CSP CO LTD·Filed 2017·Granted Dec 3, 2019·0 cites·18 claims
- 2736US2019074258A1Solder pad, semiconductor chip comprising solder pad, and forming method thereforCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
- 2836US2019165013A1Package for iris recognition imaging module and manufacturing method thereofCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Application pending·0 cites
- 2934US10541262B2Image sensing chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted Jan 21, 2020·0 cites·12 claims
- 3034US10096643B2Fingerprint recognition chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Granted Oct 9, 2018·0 cites·15 claims
- 3134US2018294302A1Image sensing chip packaging structure and methodCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
- 3234US2018308890A1Image sensing chip packaging structure and packaging method thereforCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
- 3333US2019067352A1Photosensitive chip packaging structure and packaging method thereofCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
- 3433US2019013302A1Packaging method and package structure for fingerprint recognition chip and drive chipCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Application pending·0 cites
- 3533US2018129848A1Chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Application pending·0 cites
- 3633US2018108585A1Chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Application pending·0 cites
- 3733US2018114048A1Chip packaging method and chip packaging structureCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Application pending·0 cites
- 3832US2019296064A1Packaging method and packaging structure for semiconductor chipCHINA WAFER LEVEL CSP CO LTD·Filed 2017·Application pending·0 cites
- 3932US2018301488A1Image sensing chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Application pending·0 cites
- 4032US2020395399A1Packaging method and packaging structure for semiconductor chipCHINA WAFER LEVEL CSP CO LTD·Filed 2017·Application pending·0 cites
- 4131US2018247962A1Image sensor package structure and packaging method thereofCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
- 4230US2019259634A1Packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2017·Application pending·0 cites
- 4329US10490583B2Packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted Nov 26, 2019·0 cites·13 claims
- 4429US10418296B2Semiconductor chip package structure and packaging method thereforCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted Sep 17, 2019·0 cites·18 claims
- 4528US2018240827A1Package structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
- 4626US2018337206A1Package structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
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