Assignee
CHINA WAFER LEVEL CSP LTD
CN·6 granted patents·2 pending applications·98 citations·filing 2006–2013
Top patents by PatentIndex Score
8 records- 0193US7394152B2Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the sameCHINA WAFER LEVEL CSP LTD·Filed 2006·Granted Jul 1, 2008·47 cites·5 claims
- 0291US7781250B2Wafer level chip size package for MEMS devices and method for fabricating the sameCHINA WAFER LEVEL CSP LTD·Filed 2008·Granted Aug 24, 2010·27 cites·10 claims
- 0387US7663213B2Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the sameCHINA WAFER LEVEL CSP LTD·Filed 2006·Granted Feb 16, 2010·20 cites·7 claims
- 0464US7795074B2WLCSP target and method for forming the sameCHINA WAFER LEVEL CSP LTD·Filed 2009·Granted Sep 14, 2010·4 cites·26 claims
- 0549US8952512B2Wafer-level package structure of light emitting diode and manufacturing method thereofCHINA WAFER LEVEL CSP LTD·Filed 2013·Granted Feb 10, 2015·0 cites·18 claims
- 0645US7755155B2Packaging structure and method for fabricating the sameCHINA WAFER LEVEL CSP LTD·Filed 2008·Granted Jul 13, 2010·0 cites·11 claims
- 0742US2010171134A1Optical converter and manufacturing method thereof and light emitting diodeCHINA WAFER LEVEL CSP LTD·Filed 2009·Application pending·0 cites
- 0840US2009102056A1Patterned Leads For WLCSP And Method For Fabricating The SameCHINA WAFER LEVEL CSP LTD·Filed 2008·Application pending·0 cites
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