Assignee
CHIPMORE TECH CORPORATION LIMITED
CN·4 granted patents·5 pending applications·0 citations·filing 2019–2021
Top patents by PatentIndex Score
9 records- 0149US2024254647A1Electroplating conductive fixtureCHIPMORE TECH CORPORATION LIMITED·Filed 2021·Application pending·0 cites
- 0245US2022328443A1Package structure and forming method thereofCHIPMORE TECH CORPORATION LIMITED·Filed 2020·Application pending·0 cites
- 0342US12599025B2Chip packaging method involving fabrication of wire bond and electroplated metal bonding pad through formation of metal gasket, passivation layer, metal seed layer, and photoresistCHIPMORE TECH CORPORATION LIMITED·Filed 2021·Granted Apr 7, 2026·0 cites·8 claims
- 0440US2024079271A1Wafer rewiring double verification structure, and manufacturing method and verification method thereofCHIPMORE TECH CORPORATION LIMITED·Filed 2021·Application pending·0 cites
- 0532US2022223556A1Ball placement structure and preparation process thereofCHIPMORE TECH CORPORATION LIMITED·Filed 2020·Application pending·0 cites
- 0631US11942432B2Method for packaging COFCHIPMORE TECH CORPORATION LIMITED·Filed 2020·Granted Mar 26, 2024·0 cites·10 claims
- 0727US12272589B2Ejector pin device for chip packagingCHIPMORE TECH CORPORATION LIMITED·Filed 2020·Granted Apr 8, 2025·0 cites·8 claims
- 0827US2024162161A1Method for preparing dielectric layer on surface of wafer, wafer structure, and method for shaping bumpCHIPMORE TECH CORPORATION LIMITED·Filed 2021·Application pending·0 cites
- 0921US12341064B2Chip redistribution structure and preparation method thereofCHIPMORE TECH CORPORATION LIMITED·Filed 2019·Granted Jun 24, 2025·0 cites·12 claims
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