Assignee
CHIPMOS TECHNOLOGIES INC
TW·123 granted patents·53 pending applications·1,070 citations·filing 1999–2018
Top patents by PatentIndex Score
176 records- 0198US7662667B2Die rearrangement package structure using layout process to form a compliant configurationCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Feb 16, 2010·63 cites·12 claims
- 0297US7642137B2Manufacturing method of chip packageCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Jan 5, 2010·83 cites·7 claims
- 0395US6534853B2Semiconductor wafer designed to avoid probed marks while testingCHIPMOS TECHNOLOGIES INC·Filed 2001·Granted Mar 18, 2003·141 cites·14 claims
- 0494US7927922B2Dice rearrangement package structure using layout process to form a compliant configurationCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Apr 19, 2011·30 cites·36 claims
- 0594US7915690B2Die rearrangement package structure using layout process to form a compliant configurationCHIPMOS TECHNOLOGIES INC·Filed 2009·Granted Mar 29, 2011·26 cites·4 claims
- 0694US7436074B2Chip package without core and stacked chip package structure thereofCHIPMOS TECHNOLOGIES INC·Filed 2005·Granted Oct 14, 2008·34 cites·29 claims
- 0793US7932531B2Chip packageCHIPMOS TECHNOLOGIES INC·Filed 2009·Granted Apr 26, 2011·29 cites·13 claims
- 0892US9728479B2Multi-chip package structure, wafer level chip package structure and manufacturing process thereofCHIPMOS TECHNOLOGIES INC·Filed 2015·Granted Aug 8, 2017·9 cites·10 claims
- 0992US6946860B2Modularized probe headCHIPMOS TECHNOLOGIES INC·Filed 2003·Granted Sep 20, 2005·57 cites·7 claims
- 1091US7973310B2Semiconductor package structure and method for manufacturing the sameCHIPMOS TECHNOLOGIES INC·Filed 2009·Granted Jul 5, 2011·37 cites·44 claims
- 1191US7615853B2Chip-stacked package structure having leadframe with multi-piece bus barCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Nov 10, 2009·21 cites·14 claims
- 1291US7510889B2Light emitting chip package and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Mar 31, 2009·32 cites·13 claims
- 1391US7088118B2Modularized probe card for high frequency probingCHIPMOS TECHNOLOGIES INC·Filed 2004·Granted Aug 8, 2006·55 cites·2 claims
- 1490US7723853B2Chip package without core and stacked chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted May 25, 2010·17 cites·5 claims
- 1590US7663246B2Stacked chip packaging with heat sink structureCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Feb 16, 2010·22 cites·20 claims
- 1688US9721913B2Semiconductor package and method of manufacturing thereofCHIPMOS TECHNOLOGIES INC·Filed 2016·Granted Aug 1, 2017·3 cites·9 claims
- 1788US7816771B2Stacked chip package structure with leadframe having inner leads with transfer padCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Oct 19, 2010·14 cites·3 claims
- 1888US7781878B2Zigzag-stacked package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Aug 24, 2010·16 cites·10 claims
- 1986US7129730B2Probe card assemblyCHIPMOS TECHNOLOGIES INC·Filed 2004·Granted Oct 31, 2006·35 cites·6 claims
- 2085US8779604B1Semiconductor structure and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Jul 15, 2014·9 cites·25 claims
- 2185US7582953B2Package structure with leadframe on offset chip-stacked structureCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Sep 1, 2009·16 cites·20 claims
- 2283US7888172B2Chip stacked structure and the forming methodCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Feb 15, 2011·15 cites·6 claims
- 2381US8836144B2Wafer level package structureCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Sep 16, 2014·5 cites·13 claims
- 2481US7969003B2Bump structure having a reinforcement memberCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Jun 28, 2011·11 cites·6 claims
- 2580US7528495B2Chip structureCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted May 5, 2009·9 cites·27 claims
- 2679US9269643B2Chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2014·Granted Feb 23, 2016·4 cites·8 claims
- 2779US7786595B2Stacked chip package structure with leadframe having bus barCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Aug 31, 2010·7 cites·13 claims
- 2878US9653429B2Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereofCHIPMOS TECHNOLOGIES INC·Filed 2015·Granted May 16, 2017·2 cites·13 claims
- 2978US8877630B1Semiconductor structure having a silver alloy bump body and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Nov 4, 2014·5 cites·6 claims
- 3077US9780056B1Solder ball, manufacturing method thereof, and semiconductor deviceCHIPMOS TECHNOLOGIES INC·Filed 2016·Granted Oct 3, 2017·3 cites·17 claims
- 3177US7812432B2Chip package with a dam structure on a die padCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Oct 12, 2010·13 cites·13 claims
- 3277US7576416B2Chip package having with asymmetric molding and turbulent plate downset designCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Aug 18, 2009·7 cites·18 claims
- 3376US10002815B2Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing processCHIPMOS TECHNOLOGIES INC·Filed 2017·Granted Jun 19, 2018·2 cites·10 claims
- 3475US8962395B2QFN package and manufacturing process thereofCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Feb 24, 2015·3 cites·5 claims
- 3574US9437542B2Chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2015·Granted Sep 6, 2016·2 cites·18 claims
- 3674US7700412B2Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layersCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Apr 20, 2010·5 cites·14 claims
- 3773US7651886B2Semiconductor device and manufacturing process thereofCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Jan 26, 2010·7 cites·9 claims
- 3873US6395622B1Manufacturing process of semiconductor devicesCHIPMOS TECHNOLOGIES INC·Filed 2001·Granted May 28, 2002·16 cites·6 claims
- 3972US9087912B2Method for wafer level packaging and a package structure thereofCHIPMOS TECHNOLOGIES INC·Filed 2014·Granted Jul 21, 2015·3 cites·20 claims
- 4071US7609053B2Wafer testing system integrated with RFID techniques and thesting method thereofCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Oct 27, 2009·8 cites·15 claims
- 4171US7514299B2Chip package structure and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Apr 7, 2009·5 cites·5 claims
- 4271US7385282B2Stacked-type chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2005·Granted Jun 10, 2008·4 cites·6 claims
- 4370US9401318B2Quad flat no-lead package and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2015·Granted Jul 26, 2016·3 cites·7 claims
- 4470US7902649B2Leadframe for leadless package, structure and manufacturing method using the sameCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Mar 8, 2011·3 cites·12 claims
- 4570US7851896B2Quad flat non-leaded chip packageCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Dec 14, 2010·4 cites·13 claims
- 4669US7915730B2Packaging conductive structure and method for manufacturing the sameCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Mar 29, 2011·7 cites·7 claims
- 4769US7446407B2Chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2005·Granted Nov 4, 2008·4 cites·13 claims
- 4868US10068861B2Semiconductor deviceCHIPMOS TECHNOLOGIES INC·Filed 2016·Granted Sep 4, 2018·4 cites·18 claims
- 4968US9859239B1Re-distribution layer structure and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2017·Granted Jan 2, 2018·3 cites·10 claims
- 5068US7981725B2Fabricating process of a chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2010·Granted Jul 19, 2011·2 cites·23 claims
Showing the top 50 of 176 patent records by PatentIndex Score.
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