Assignee
CHIPPAC INC
US·69 granted patents·18 pending applications·3,075 citations·filing 2001–2010
Top patents by PatentIndex Score
87 records- 0199US7101731B2Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) packageCHIPPAC INC·Filed 2005·Granted Sep 5, 2006·86 cites·20 claims
- 0299US6933598B2Semiconductor stacked multi-package module having inverted second package and electrically shielded first packageCHIPPAC INC·Filed 2003·Granted Aug 23, 2005·190 cites·30 claims
- 0399US6906416B2Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) packageCHIPPAC INC·Filed 2003·Granted Jun 14, 2005·183 cites·22 claims
- 0498US7247519B2Method for making a semiconductor multi-package module having inverted bump chip carrier second packageCHIPPAC INC·Filed 2006·Granted Jul 24, 2007·42 cites·6 claims
- 0598US7169642B2Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) packageCHIPPAC INC·Filed 2006·Granted Jan 30, 2007·47 cites·19 claims
- 0698US7166494B2Method of fabricating a semiconductor stacked multi-package module having inverted second packageCHIPPAC INC·Filed 2006·Granted Jan 23, 2007·37 cites·8 claims
- 0798US7061088B2Semiconductor stacked multi-package module having inverted second packageCHIPPAC INC·Filed 2003·Granted Jun 13, 2006·125 cites·11 claims
- 0898US7057269B2Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) packageCHIPPAC INC·Filed 2003·Granted Jun 6, 2006·103 cites·12 claims
- 0998US7053477B2Semiconductor multi-package module having inverted bump chip carrier second packageCHIPPAC INC·Filed 2003·Granted May 30, 2006·125 cites·14 claims
- 1098US7049691B2Semiconductor multi-package module having inverted second package and including additional die or stacked package on second packageCHIPPAC INC·Filed 2003·Granted May 23, 2006·100 cites·13 claims
- 1198US7045887B2Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) packageCHIPPAC INC·Filed 2003·Granted May 16, 2006·120 cites·22 claims
- 1298US7034387B2Semiconductor multipackage module including processor and memory package assembliesCHIPPAC INC·Filed 2003·Granted Apr 25, 2006·118 cites·38 claims
- 1398US6838761B2Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shieldCHIPPAC INC·Filed 2003·Granted Jan 4, 2005·222 cites·30 claims
- 1497US7288434B2Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second packageCHIPPAC INC·Filed 2006·Granted Oct 30, 2007·28 cites·31 claims
- 1597US7064426B2Semiconductor multi-package module having wire bond interconnect between stacked packagesCHIPPAC INC·Filed 2003·Granted Jun 20, 2006·129 cites·10 claims
- 1697US7033859B2Flip chip interconnection structureCHIPPAC INC·Filed 2004·Granted Apr 25, 2006·85 cites·23 claims
- 1797US6815252B2Method of forming flip chip interconnection structureCHIPPAC INC·Filed 2001·Granted Nov 9, 2004·84 cites·25 claims
- 1896US7306973B2Method for making a semiconductor multipackage module including a processor and memory package assembliesCHIPPAC INC·Filed 2006·Granted Dec 11, 2007·31 cites·13 claims
- 1996US7053476B2Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packagesCHIPPAC INC·Filed 2003·Granted May 30, 2006·103 cites·20 claims
- 2096US6972481B2Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packagesCHIPPAC INC·Filed 2003·Granted Dec 6, 2005·118 cites·17 claims
- 2195US7494847B2Method for making a semiconductor multi-package module having inverted wire bond carrier second packageCHIPPAC INC·Filed 2007·Granted Feb 24, 2009·18 cites·6 claims
- 2295US7364946B2Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) packageCHIPPAC INC·Filed 2007·Granted Apr 29, 2008·20 cites·18 claims
- 2394US7749807B2Method of fabricating a semiconductor multipackage module including a processor and memory package assembliesCHIPPAC INC·Filed 2007·Granted Jul 6, 2010·24 cites·26 claims
- 2494US6967126B2Method for manufacturing plastic ball grid array with integral heatsinkCHIPPAC INC·Filed 2003·Granted Nov 22, 2005·80 cites·17 claims
- 2594US6661083B2Plastic semiconductor packageCHIPPAC INC·Filed 2002·Granted Dec 9, 2003·102 cites·10 claims
- 2693US7358115B2Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sidesCHIPPAC INC·Filed 2007·Granted Apr 15, 2008·13 cites·8 claims
- 2793US7279361B2Method for making a semiconductor multi-package module having wire bond interconnect between stacked packagesCHIPPAC INC·Filed 2006·Granted Oct 9, 2007·22 cites·7 claims
- 2893US7253511B2Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array packageCHIPPAC INC·Filed 2004·Granted Aug 7, 2007·67 cites·44 claims
- 2992US7671451B2Semiconductor package having double layer leadframeCHIPPAC INC·Filed 2005·Granted Mar 2, 2010·41 cites·9 claims
- 3091US7692279B2Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array packageCHIPPAC INC·Filed 2007·Granted Apr 6, 2010·18 cites·8 claims
- 3191US6940178B2Self-coplanarity bumping shape for flip chipCHIPPAC INC·Filed 2002·Granted Sep 6, 2005·51 cites·13 claims
- 3290US7205647B2Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packagesCHIPPAC INC·Filed 2003·Granted Apr 17, 2007·50 cites·13 claims
- 3390US7034391B2Flip chip interconnection pad layoutCHIPPAC INC·Filed 2004·Granted Apr 25, 2006·40 cites·16 claims
- 3489US7880313B2Semiconductor flip chip package having substantially non-collapsible spacerCHIPPAC INC·Filed 2005·Granted Feb 1, 2011·17 cites·6 claims
- 3589US6780682B2Process for precise encapsulation of flip chip interconnectsCHIPPAC INC·Filed 2002·Granted Aug 24, 2004·42 cites·9 claims
- 3689US6549413B2Tape ball grid array semiconductor package structure and assembly processCHIPPAC INC·Filed 2002·Granted Apr 15, 2003·60 cites·20 claims
- 3788US7351610B2Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrateCHIPPAC INC·Filed 2007·Granted Apr 1, 2008·7 cites·16 claims
- 3887US7368817B2Bump-on-lead flip chip interconnectionCHIPPAC INC·Filed 2004·Granted May 6, 2008·24 cites·46 claims
- 3986US7935572B2Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packagesCHIPPAC INC·Filed 2010·Granted May 3, 2011·6 cites·35 claims
- 4086US7453156B2Wire bond interconnectionCHIPPAC INC·Filed 2005·Granted Nov 18, 2008·11 cites·22 claims
- 4185US8030134B2Stacked semiconductor package having adhesive/spacer structure and insulationCHIPPAC INC·Filed 2006·Granted Oct 4, 2011·10 cites·32 claims
- 4285US7208821B2Multichip leadframe packageCHIPPAC INC·Filed 2005·Granted Apr 24, 2007·19 cites·22 claims
- 4384US6828220B2Flip chip-in-leadframe package and processCHIPPAC INC·Filed 2001·Granted Dec 7, 2004·50 cites·18 claims
- 4484US6737295B2Chip scale package with flip chip interconnectCHIPPAC INC·Filed 2002·Granted May 18, 2004·34 cites·14 claims
- 4583US7436048B2Multichip leadframe packageCHIPPAC INC·Filed 2007·Granted Oct 14, 2008·15 cites·22 claims
- 4683US7420263B2DBG system and method with adhesive layer severingCHIPPAC INC·Filed 2006·Granted Sep 2, 2008·7 cites·19 claims
- 4782US7829382B2Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array packageCHIPPAC INC·Filed 2010·Granted Nov 9, 2010·5 cites·20 claims
- 4882US7691681B2Chip scale package having flip chip interconnect on die paddleCHIPPAC INC·Filed 2008·Granted Apr 6, 2010·11 cites·25 claims
- 4980US7605480B2Flip chip interconnection pad layoutCHIPPAC INC·Filed 2006·Granted Oct 20, 2009·6 cites·43 claims
- 5080US7372170B2Flip chip interconnection pad layoutCHIPPAC INC·Filed 2006·Granted May 13, 2008·6 cites·20 claims
Showing the top 50 of 87 patent records by PatentIndex Score.
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